Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices

ABSTRACT

In one aspect, the invention includes a method of encapsulating a semiconductor device, comprising: a) providing a semiconductor device; b) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; and c) dispensing a liquid encapsulating material through the plurality of orifices and over the semiconductor device. In another aspect, the invention includes a method of forming an electronic package, comprising: a) providing a circuit board having a circuit pattern; b) joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern; c) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices; d) simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices; and e) curing the liquid encapsulating material.

TECHNICAL FIELD

The invention pertains to methods of encapsulating semiconductordevices, such as, for example, methods of forming electronic packages,as well as to encapsulator devices.

BACKGROUND OF THE INVENTION

Semiconductor chips are frequently connected to a circuit board andsubsequently encapsulated within a sealant compound to form a sealedpackage during semiconductor device manufacture. Among the methods thatcan be utilized for connecting chips to circuit boards are, for example,wire bonding, flip chip, chip on board, and tape automated bonding. Allfour methods can be followed by the application and curing of one ormore liquid encapsulants over the chips and nearby circuitry. The curedencapsulants can protect the chips and their associated electronicinterconnections to the boards from physical damage and ioniccontamination.

The liquid encapsulants are typically applied by dispensing theencapsulants to form a glob over one or more chips and their associatedelectrical interconnections. Hence, the technology of providing suchencapsulants is frequently referred to by the term “glob-top”encapsulation. The encapsulants can be provided as single globs oversingle chips (so-called “single chip modules”), or as single globsencompassing multi-chip units (so-called “multi-chip modules”).

Glob-top encapsulation was originally introduced for consumer packagessuch as, for example, video games, but the demand for miniaturizedcircuitry led to the use of glob-top as a preferred assembly method formany types of products including, for example, smart credit cards, andmicroprocessor circuitry. Glob-top encapsulation technology can enablemanufacturers to make relatively thin devices, and also enables manycompanies to produce packages with cost equal to or less thanconventional plastic packages. Typical glob-top compositions includeepoxy or silicone encapsulating resins which provide protection againstcorrosion, vibration and mechanical stresses.

An exemplary automated process for applying a glob-top encapsulant to achip is as follows. First, an integrated circuit chip is provided on acircuit board. The chip has exposed electrical leads (or pads) providedin electrical contact with corresponding leads (or pads) on the circuitboard. The electrical connection can comprise, for example, a wire bondcomprising exposed gold wires connecting the leads of the chip withthose of the circuit board. Next, encapsulant is pumped through a singlesyringe to form a glob over the chip and over the electrical connectionsof the chip to the circuit board. Typically, the single syringe is movedrelative to the chip as the encapsulant is provided. In one method, thesyringe is first moved to dispense encapsulant around a periphery of thechip and form a dam of encapsulant material. The syringe is then movedover a center of the chip to provide encapsulant onto the chip. Theencapsulant provided onto the chip is prevented from flowing beyond theperiphery of the chip by the dam that was initially provided. Theencapsulant utilized for the dam can be different- than that providedover a center of the chip. Specifically, the encapsulant utilized forforming the dam can be a so-called “dam” encapsulant and that providedover the center of the chip can be a so-called “fill” encapsulant. Damencapsulants are generally more viscous than fill encapsulants. Afterthe encapsulant is provided, it is cured by, for example, thermalprocessing to solidify the encapsulant material.

A continuing goal in semiconductor processing is to increase speed ofsemiconductor device fabrication. Accordingly, it would be desirable toincrease the speed with which chips are encapsulated.

SUMMARY OF THE INVENTION

In one aspect, the invention encompasses a method of encapsulating asemiconductor device. A semiconductor device is provided. A dispensingapparatus is provided proximate the semiconductor device. The dispensingapparatus has a plurality of orifices. A liquid encapsulating materialis dispensed through the plurality of orifices and over thesemiconductor device.

In another aspect, the invention encompasses a method of forming anelectronic package. A circuit board comprising a circuit pattern iselectrically connected with a semiconductor device. A dispensingapparatus is provided proximate the semiconductor device. The dispensingapparatus has a plurality of dispensing orifices. A liquid encapsulatingmaterial is dispensed through the plurality of orifices and onto thesemiconductor device. The encapsulating material is then cured.

In yet another aspect, the invention encompasses a semiconductor deviceencapsulator comprising a vessel configured for containing liquidencapsulant material, and a liquid dispensing apparatus in fluidcommunication with the vessel. The apparatus has a plurality ofdispensing orifices. At least one of the dispensing orifices isconfigured for receipt over and within lateral confines of asemiconductor device being encapsulated.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic, perspective view of a preliminary step of amethod of encapsulating semiconductor chips in accordance with thepresent invention. FIG. 1 illustrates a circuit board and anencapsulating material dispensing device.

FIG. 2 is a view of the FIG. 1 encapsulating material dispensing deviceshown along the line 2—2 of FIG. 1.

FIG. 3 is a fragmentary, exploded top view of a portion of the FIG. 1circuit board shown at a processing step subsequent to that of FIG. 1.

FIG. 4 is a view of the FIG. 3 fragment shown at a processing stepsubsequent to that of FIG. 3.

FIG. 5 is an exploded, fragmentary, top view of a portion of the FIG. 1circuit board processed according to an alternative method of thepresent invention.

FIG. 6 is a view of the FIG. 5 fragment shown at a processing stepsubsequent to that of FIG. 5.

FIG. 7 is a view of the FIG. 5 fragment shown at a processing stepsubsequent to that of FIG. 6.

FIG. 8 is a diagrammatic, perspective view of a preliminary step of asecond embodiment method of encapsulating semiconductor chips inaccordance with the present invention. FIG. 8 illustrates a circuitboard and a second embodiment encapsulating material dispensing device.

FIG. 9 is an exploded top view of a portion of the FIG. 8 circuit boardshown at a processing step subsequent to that of FIG. 8.

FIG. 10 is a view of the FIG. 9 circuit board shown at a processing stepsubsequent to that of FIG. 9.

FIG. 11 is a view of the FIG. 9 circuit board shown at a processing stepsubsequent to that of FIG. 10.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts”. (Article 1, Section. 8).

An encapsulant forming apparatus (encapsulator) 10 encompassed by thepresent invention is described with reference to FIG. 1. FIG. 1illustrates apparatus 10 positioned relative to a circuit board 12having semiconductor devices 14 positioned thereon. Semiconductordevices 14 can comprise, for example, integrated circuit chips.Semiconductor devices 14 are in electrical connection with a circuit(not shown) provided on or within circuit board 12. In the shownembodiment, the electrical interconnection comprises wire bonding.Specifically, the interconnection comprises wires 16 (only some of whichare labeled) which electrically connect nodes (not shown) provided on orwithin semiconductor devices 14 with nodes (not shown) provided on orwithin circuit board 12. Wires 16 can comprise, for example, thin goldwires.

Apparatus 10 comprises a plurality of orifices 20 connected to a orificesupport 22. Orifices 20 can comprise, for example, nozzles. Orifices 20are in fluid connection with an inlet 24, which in turn is in fluidconnection with a liquid encapsulant source 26. Inlet 24 can comprise,for example, tubing that is chemically inert relative to the liquidencapsulant material flowed through inlet 24. Source 26 can comprise avessel configured to contain a liquid encapsulant material. Inoperation, liquid encapsulant is flowed from source 26, through inlet24, and out of orifices 20. The flow of liquid encapsulant material canbe powered by conventional methods, such as, for example, a pump (notshown) provided between source 26 and inlet 24. Additionally, valves canbe provided between orifices 20 and source 26 to control flow ofmaterial out of orifices 20. In the shown embodiment, all of orifices 20are connected to a common source 26. It is to be understood, however,that the invention encompasses alternative embodiments wherein one ormore of orifices 20 are connected to a different encapsulant source thanare others of orifices 20. Utilization of different encapsulant sourcescan enable different encapsulants to be flowed through differentorifices. Apparatus 10 can further comprise a table (not shown)configured to retain circuit board 12 in precise alignment with orifices20.

FIG. 2 is a view of apparatus 10 along the line 2—2 of FIG. 1. FIG. 2illustrates a preferred embodiment of apparatus 10 comprising fiveoutlet orifices 20. One of outlet orifices 20 is interiorly locatedrelative to the remaining four outlet orifices 20. Such interiorlylocated outlet orifice 20 will provide encapsulant onto a semiconductordevice 14, while the remaining outlet orifices 20 provide encapsulantaround a periphery of semiconductor device 14. Such is illustrated inFIG. 3, wherein a fragment of circuit board 12 is illustrated afterdispensing of an encapsulant material 30 through orifices 20 (FIG. 2).

The encapsulant material 30 in FIG. 3 is provided as a series of fivedrops in locations corresponding to the locations of outlet orifices 20of FIG. 2. Such five drops comprise a single drop 31 interiorly locatedon semiconductor device 14, and four drops 33 around a periphery ofdevice 14. Drop 31 is from the interiorly located dispensing orifice 20received over and within lateral confines of the semiconductor device 14being encapsulated. Drops 33 are from dispensing orifices 20 receivedoutside of lateral confines of the semiconductor device 14 beingencapsulated.

The five separate drops of encapsulant material 30 can be formed, forexample, by simultaneously dispensing encapsulant material 30 throughall five of orifices 20 (FIG. 2). Alternatively, the five drops can beformed sequentially by dispensing encapsulant materialnon-simultaneously through orifices 20. For instance, drops 33 at theperiphery of device 14 can be dispensed first to form a dam arounddevice 14, and subsequently interiorly located drop 31 can be dispensedover device 14.

Referring to FIG. 4, the wafer fragment of FIG. 3 is illustrated afterfurther dispensing of liquid encapsulant material 30 from orifices 20.Liquid encapsulant 30 now encapsulates an entirety of semiconductordevice 14 (shown in phantom) and the wires 16 (shown in phantom).Encapsulant 30 thus forms a glob-top over semiconductor device 14.Encapsulant 30 can next be cured by, for example, thermal processing, tosolidify encapsulant 30 into a protective coating adhered oversemiconductor device 14 and wires 16.

FIG. 5 illustrates an alternative method of the present inventionwherein encapsulant 30 is distributed about a periphery of semiconductordevice 14 prior to dispensing encapsulant 30 onto a central region ofsemiconductor device 14. The dispense pattern of FIG. 5 can be formedby, for example, utilizing the orifice arrangement of FIG. 2 androtating either support structure 22, circuit board 12, or both asencapsulant material is dispensed from the peripherally located orifices20. Alternatively, the dispense pattern of FIG. 5 can be formed byutilizing an apparatus 10 having a different orifice arrangement thanthat illustrated in FIG. 2. Such different orifice arrangement could,for example, correspond to a plurality of orifices arranged in a patterncorresponding to that of the dispensed encapsulant shown in FIG. 5.

Referring to FIG. 6, the wafer fragment of FIG. 5 is illustrated afterprovision of sufficient encapsulant to form a dam 32 aroundsemiconductor device 14.

Referring to FIG. 7, the circuit board fragment of FIG. 6 is shown afterprovision of an encapsulant material within a center of dam 32 (FIG. 6)to overlay semiconductor device 14 (shown in phantom). The encapsulantprovided to overlay device 14 can be dispensed from one or moreinteriorly located orifices of an encapsulant dispensing deviceanalogous to the device 10 of FIGS. 1 and 2. The encapsulant providedwithin the center of dam 32 can comprise the same encapsulant materialas that utilized for forming dam 32, or a different material.Utilization of a different material can enable the material of dam 32 tohave a different viscosity than that utilized to overlay semiconductordevice 14. For instance, the material utilized for dam 32 can be aso-called “dam” encapsulant and that utilized over device 14 can be aso-called “fill” encapsulant.

After provision of encapsulant material over device 14, a glob 36comprising the encapsulant material over device 14 and the material ofdam 32 (FIG. 6) is formed to encapsulate device 14 and the wires 16extending to device 14. The encapsulated semiconductor device 14 andcircuit board 12 together comprise an electronic package.

A second embodiment encapsulant dispensing apparatus 50 is describedwith reference to FIG. 8. Apparatus 50 comprises four spaced sets (52,54, 56 and 58) of dispensing orifices (52 a, 54 a, 56 a and 58 a)configured as a linear array. Each of the orifice sets is in fluidcommunication with a liquid encapsulant source 60. Orifice sets 52, 54,56 and 58 can comprise, for example, the orifice configuration describedabove with reference to the apparatus 10 of FIGS. 1 and 2. It is notedthat the invention encompasses other embodiments (not shown) wherein thespaced orifice sets are replaced with spaced single orifices. Also,although each of the shown orifice sets comprises the same number andarrangements of orifices, the invention encompasses other embodiments(not shown) wherein some of the orifice sets comprise a different numberand/or arrangement of orifices than other orifice sets.

A circuit board 70 is shown in FIG. 8. Circuit board. 70 comprisessemiconductor devices 72, 74, 76, 78, 82, 84, 86 and 88. Semiconductordevices 72, 74, 76, and 78 form a first array of four devices, andsemiconductor devices 82, 84, 86 and 88 form a second array of fourdevices. The array of dispensing orifice sets 52, 54, 56 and 58 isprovided such that each of the individual orifice sets 52, 54, 56 and 58is in correspondence with individual semiconductor devices of the firstarray of semiconductor devices. Specifically, orifice set 52 is incorrespondence with semiconductor device 72, orifice set 54 is incorrespondence with semiconductor device 74, orifice set 56 is incorrespondence with semiconductor device 76, and orifice set 58 is incorrespondence with semiconductor device 78.

FIG. 9 shows circuit board 70 after a liquid encapsulating material 90is dispensed through the orifices of sets 52, 54, 56 and 58. Liquidencapsulant material 90 can be dispensed simultaneously through all oforifice sets 52, 54, 56 and 58, or sequentially through one or more ofthe sets. In the embodiment of FIG. 9, the encapsulant material isprovided around a periphery of each of semiconductor devices 72, 74, 76and 78, as well as over each of semiconductor devices 72, 74, 76 and 78.Such pattern is identical to that described above with reference to FIG.3. Variations. of the encapsulant dispensing can be conducted inaccordance with variations discussed above with reference to FIGS. 3 and5. Specifically, the encapsulant provided around the peripheries of oneor more devices 72, 74, 76 and 78 can be provided prior to encapsulantbeing provided over one or more of devices 72, 74, 76 and 78, or aftersuch provision. Also, one or more of orifices 52 a, 54 a, 56 a and 58 acan be moved relative to semiconductor devices 72, 74, 76 and 78 duringdispensing of encapsulant material 90. Such moving can comprise eithermoving circuit board 70 during the dispensing, moving one or more oforifice sets 52, 54, 56 and 58 during the dispensing, or moving bothcircuit board 70 and one or more of orifice sets 52, 54, 56 and 58during the dispensing.

Referring to FIG. 10, additional encapsulant 90 is provided relative tosemiconductor wafer 72, 74, 76 and 78 (shown in phantom) to form globsof encapsulant which entirely encapsulate semiconductor devices 72, 74,76 and 78.

Referring to FIG. 11, the array of orifice sets 52, 54, 56 and 58 (FIG.8) is moved relative to circuit board 70 to align the array withsemiconductor devices 82, 84, 86 and 88. Subsequently, encapsulant 90 isflowed over semiconductor devices 82, 84, 86 and 88 to formencapsulating globs over such devices. The movement of the array oforifice sets, 52, 54, 56 and 58 relative to circuit board 70 cancomprise, for example, either moving orifice sets 52, 54, 56 and 58,moving circuit board 70, or moving both orifice sets 52, 54, 56 and 58and circuit board 70.

In the shown embodiment of FIGS. 8-11, all of orifices 52 a, 54 a, 56 aand 58 a dispense a common encapsulant material. However, it is to beunderstood that the invention encompasses other embodiments (not shown)wherein one or more of orifices 52 a, 54 a, 56 a and 58 a dispense adifferent encapsulant from remaining orifices 52 a, 54 a, 56 a and 58 a.Such alternative embodiments can comprise, for example, utilizing adifferent encapsulant to form dams analogous to the dam 32 of FIG. 6around one or more of semiconductive devices 72, 74, 76, 78, 82, 84, 86and 88 prior to providing encapsulant on or over a center of suchdevices.

In the above-discussed embodiments, the semiconductor devices compriserectangular shapes, and more specifically comprise square shapes.However, it is to be understood that the invention encompasses otherembodiments wherein the semiconductor devices comprise other shapes. Theconfiguration of orifices utilized to provide encapsulant relative tosuch other shaped semiconductor devices can be adapted to provideencapsulant both around a periphery of the devices and over the devices.Also, it is noted that although the above-described drawings illustratedispensing of encapsulant at peripheries of semiconductor devices aswell as over the devices, the invention encompasses other embodiments(not shown) where an encapsulant is dispensed only over a device, oronly at a periphery of a device. In such other embodiments theencapsulant can be dispensed and then subsequently flowed from over thedevice to the periphery, or from the periphery to over the device, sothat both the device and the interconnects at the device periphery areencapsulated.

In the embodiment shown in FIGS. 8-11, the array of orifice sets 52, 54,56 and 58 is a linear array. However, the invention encompasses otherembodiments (not shown) wherein the array is non-linear. For instance,the array could be a matrix. An exemplary matrix comprises eight orificesets configured in four columns having two rows each.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method of encapsulating a semiconductor device,comprising: providing at least one semiconductor device; providing adispensing apparatus having a plurality of dispensing orifices proximatethe at least one semiconductor device; dispensing a first liquidencapsulating material through at least one of the plurality of orificesand over the at least one semiconductor device and dispensing a secondliquid encapsulating material through at least one other of theplurality of orifices, wherein the first liquid encapsulating materialis different from the second liquid encapsulating material; and whereinthe plurality of dispensing orifices has rotational movement whilemaintaining the proximity to the at least one semiconductor device. 2.The method of claim 1 wherein the first liquid encapsulating material isdispensed onto the at least one semiconductor device.
 3. The method ofclaim 1 further comprising curing the dispensed first and second liquidencapsulating materials.
 4. The method of claim 1 wherein the dispensingcomprises flowing the first and second liquid encapsulating materialssimultaneously through the plurality of orifices.
 5. The method of claim1 wherein the dispensing comprises moving the at least one of theorifices relative to the at least one semiconductor device while flowingthe liquid encapsulating material through the at least one orifice. 6.The method of claim 5 wherein the moving comprises moving the at leastone semiconductor device.
 7. The method of claim 5 wherein the movingcomprises moving the at least one orifice.
 8. The method of claim 1wherein the at least one semiconductor device is an integrated circuitchip.
 9. A method of forming an electronic package, comprising:providing a circuit board comprising a circuit pattern; joining asemiconductor device to the circuit board in electrical connection withthe circuit pattern; providing a dispensing apparatus having a pluralityof dispensing orifices proximate the semiconductor device; dispensingliquid encapsulating material through the plurality of orifices and ontothe semiconductor device, wherein at least one orifice dispenses liquidencapsulating material only onto the semiconductor device; curing theliquid encapsulating material; and wherein the plurality of dispensingorifices has rotational movement about a vertical pivot axis spaced fromthe dispensing orifices while maintaining the proximity to thesemiconductor device.
 10. The method of claim 9 wherein the dispensingcomprises dispensing liquid through only one of the orifices and ontothe semiconductor device, and dispensing liquid through a remainder ofthe plurality of orifices and onto the circuit board proximate thesemiconductor device.
 11. The method of claim 9 wherein the dispensingcomprises dispensing liquid through the at least one of the orifices andonto the semiconductor device, and dispensing liquid through a remainderof the plurality of orifices and onto the circuit board proximate thesemiconductor device.
 12. The method of claim 11 wherein the liquiddispensed through the remainder of orifices is the same as thatdispensed through the at least one orifice.
 13. The method of claim 11wherein the liquid dispensed through the remainder of orifices isdifferent than that dispensed through the at least one orifice.
 14. Themethod of claim 11 wherein the dispensing through the remainder oforifices occurs simultaneously with the dispensing through the at leastone orifice.
 15. The method of claim 11 wherein the remainder oforifices comprises at least four orifices.
 16. The method of claim 15wherein the semiconductor device comprises a square-shaped lateralperiphery.
 17. The method of claim 9 wherein the semiconductor device isan integrated circuit chip.
 18. The method of claim 9 wherein thedispensing comprises dispensing liquid through only one of the orificesand onto the semiconductor device, and dispensing liquid through aremainder of the plurality of orifices and onto the circuit board toencircle the semiconductor device.
 19. The method of claim 9 wherein thevertical axis extends through the semiconductor device.
 20. A method ofencapsulating at least two semiconductor devices, comprising: providingat least two semiconductor devices over a substrate; a providing adispensing apparatus having at least two dispensing orifices, a first ofthe at least two dispensing orifices being received proximate a first ofthe at least two semiconductor devices and a second of the at least twodispensing orifices being received proximate a second of the at leasttwo semiconductor devices wherein the at least two dispensing orificeshas rotation about a vertical pivot axis spaced from the dispensingorifices; and simultaneously dispensing a liquid encapsulating materialthrough the at least two orifices and over the at least twosemiconductor devices wherein the dispensing apparatus is continuouslyspaced from the semiconductor devices and substrate.
 21. The method ofclaim 20 wherein the liquid encapsulating material is dispensed onto atleast one of the at least two semiconductor devices.
 22. The method ofclaim 20 wherein the liquid encapsulating material is dispensed ontoboth of the at least two semiconductor devices.
 23. The method of claim20 further comprising curing the dispensed liquid encapsulatingmaterial.
 24. The method of claim 20 wherein the dispensing comprisesmoving the at least two orifices relative to the semiconductor deviceswhile flowing the liquid encapsulating material through the at least twoorifices.
 25. The method of claim 20 wherein the semiconductor devicesare integrated circuit chips.
 26. A method of encapsulating a pluralityof semiconductor devices, comprising: providing a plurality ofsemiconductor devices over substrate; providing a dispensing apparatushaving an array of dispensing orifice sets, individual sets of the arraybeing in correspondence with individual semiconductor devices of theplurality of semiconductor devices wherein at least one dispensingorifice has rotation about a vertical pivot axis spaced from the atleast one dispensing orifice; and simultaneously dispensing liquidencapsulating material through orifices of different sets, and at leasta portion of the liquid encapsulating material defining a discreteportion over the semiconductor device spaced from the substrate.
 27. Themethod of claim 26 wherein the array of dispensing orifice sets isaligned with a first array of the plurality of semiconductor devicesduring the dispensing, the method further comprising moving the arraydispensing orifice sets to alignment with a second array ofsemiconductor devices after the dispensing.
 28. The method of claim 26wherein the liquid encapsulating material dispensed through each of thedifferent sets is the same.
 29. The method of claim 26 furthercomprising curing the dispensed liquid encapsulating material.
 30. Themethod of claim 26 wherein the dispensing comprises moving at least someof the orifices relative to the semiconductor devices during thedispensing.
 31. The method of claim 26 wherein the semiconductor devicesare integrated circuit chips.
 32. The method of claim 26 wherein theindividual sets comprise at least one interiorly located orifice andremaining orifices peripheral to the at least one interiorly locatedorifice, the dispensing from an individual set comprising: dispensing afirst liquid encapsulating material through the at least one interiorlylocated orifice and over a corresponding semiconductor device; anddispensing a second liquid encapsulating material through the remainingorifices and over a portion of the substrate proximate the correspondingsemiconductor device.
 33. The method of claim 32 wherein the at leastone interiorly located orifice is one orifice, and wherein the remainingorifices are four orifices.
 34. The method of claim 32 wherein the firstand second liquid encapsulating materials are the same.
 35. The methodof claim 32 wherein the dispensing through said at least one interiorlylocated orifice occurs simultaneously with the dispensing through saidremaining orifices.
 36. The method of claim 32 wherein the dispensingthrough said at least one interiorly located orifice occurs after thedispensing through said remaining orifices.
 37. A method ofencapsulating a plurality of semiconductor devices, comprising:providing a plurality of semiconductor devices over substrate; providinga dispensing apparatus having an array of spaced dispensing orifices,individuals of the array being in correspondence with individualsemiconductor devices of the plurality of semiconductor devices whereinat least one dispensing orifice has rotation about a vertical pivot axisspaced from the at least one dispensing orifice; and simultaneouslydispensing liquid encapsulating material through at least two of thespaced dispensing orifices and onto at least two of the individualsemiconductor devices, at least a portion of the liquid encapsulatingmaterial defining a discrete portion over the semiconductor devicespaced from the substrate.
 38. A method of forming an electronicpackage, comprising: providing a circuit board comprising a circuitpattern; joining a plurality of semiconductor devices to the circuitboard in electrical connection with the circuit pattern; providing adispensing apparatus having a plurality of dispensing orifices proximatethe semiconductor devices wherein the plurality of dispensing orificeshas rotational movement about a vertical pivot axis spaced from theplurality of dispensing orifices; simultaneously dispensing liquidencapsulating material through at least two of the plurality of orificesand over at least two of the semiconductor devices, at least a portionof the liquid encapsulating material defining a discrete portion overthe semiconductor device spaced from the substrate; and curing theliquid encapsulating material.
 39. The method of claim 38 wherein thedispensing comprises dispensing the liquid onto the at least twosemiconductor devices.
 40. The method of claim 38 wherein the dispensingcomprises: dispensing a first liquid encapsulating material through theat least two orifices and over the at least two semiconductor devices;and dispensing a second liquid encapsulating material through aremainder of the plurality of orifices and onto portions of the circuitboard proximate the at least two semiconductor devices.
 41. The methodof claim 40 wherein the liquid dispensed through the remainder oforifices is the same as that dispensed through the at least twoorifices.
 42. The method of claim 40 wherein the dispensing through theremainder of orifices occurs simultaneously with the dispensing throughthe at least two orifices.
 43. The method of claim 40 wherein thedispensing through the remainder of orifices occurs before thedispensing through the at least two orifices.
 44. The method of claim 38wherein the semiconductor device is an integrated circuit chip.
 45. Amethod of forming an electronic package, comprising: providing a circuitboard comprising a circuit pattern; joining a plurality of semiconductordevices to the circuit board in electrical connection with the circuitpattern, the semiconductor devices being arranged in a plurality ofarrays; providing a dispensing apparatus having a plurality ofdispensing orifices proximate some of the semiconductor devices, thedispensing orifices being arranged in a single array of orifice setswhich is aligned with a single of the semiconductor device arrayswherein at least one dispensing orifice has rotational movement about avertical pivot axis spaced from the at least one dispensing orifice;simultaneously dispensing liquid encapsulating material through thearray of orifice sets and over the single array of semiconductor deviceswherein at least a portion of the liquid encapsulating material definesa discrete portion over the semiconductor device spaced from thesubstrate; moving the orifice sets to align with another of thesemiconductor device arrays; and simultaneously dispensing liquidencapsulating material through the array of orifice sets and over theother array of semiconductor devices wherein at least a portion of theliquid encapsulating material defines a discrete portion over thesemiconductor device spaced from the substrate.
 46. The method of claim45 wherein the individual orifice sets comprise five orifices.
 47. Themethod of claim 45 wherein the individual orifice sets comprise at leasttwo orifices, and wherein the dispensing from an individual orifice setcomprises: dispensing a first liquid encapsulating material through oneof the at least two orifices and over an individual of the plurality ofsemiconductor devices; and dispensing a second liquid encapsulatingmaterial through a second of the at least two orifices and over portionsof the circuit board proximate the individual semiconductor device. 48.The method of claim 47 wherein the first and second liquid encapsulatingmaterials are the same.
 49. The method of claim 47 wherein the first andsecond liquid encapsulating materials are different.
 50. The method ofclaim 47 wherein the first and second liquid encapsulating materials aredispensed simultaneously.
 51. The method of claim 45 wherein the orificesets comprise at least one interiorly located orifice and remainingperipherally located orifices, and wherein the dispensing from anindividual orifice set comprises: dispensing a first liquidencapsulating material through said at least one interiorly locatedorifice and onto an individual of the plurality of semiconductordevices; and dispensing a second liquid encapsulating material throughsaid remaining orifices and onto portions of the circuit board proximatethe individual semiconductor device.
 52. The method of claim 45 whereinthe orifice sets comprise five orifices, and wherein the dispensing froman individual orifice set comprises: dispensing a first liquidencapsulating material through one of the five orifices and onto anindividual of the plurality of semiconductor devices; and dispensing asecond liquid encapsulating material through a remaining four of thefive orifices and onto portions of the circuit board proximate theindividual semiconductor device.
 53. The method of claim 52 wherein thefirst and second liquid encapsulating materials are the same.
 54. Themethod of claim 52 wherein the first and second liquid encapsulatingmaterials are dispensed simultaneously.
 55. A method of forming anelectronic package, comprising: providing a circuit board comprising acircuit pattern; joining a plurality of semiconductor devices to thecircuit board in electrical connection with the circuit pattern, thesemiconductor devices being arranged in a plurality of arrays; providinga dispensing apparatus having a plurality of spaced dispensing orificesproximate some of the semiconductor devices, the spaced dispensingorifices being arranged in a single array which is aligned with a singleof the semiconductor device arrays wherein at least one dispensingorifice has rotational movement about a vertical pivot axis spaced fromthe at least one dispensing orifice; simultaneously dispensing liquidencapsulating material through the array of orifices and over the singlearray of semiconductor devices wherein at least a portion of the liquidencapsulating material defines a discrete portion over the circuit boardspaced from the semiconductor devices; moving the orifices to align withanother of the semiconductor device arrays; and simultaneouslydispensing liquid encapsulating material through the array of orificesand over the other array of semiconductor devices wherein at least aportion of the liquid encapsulating material defines a discrete portionover the circuit board spaced from the semiconductor devices.